| 1 | AWOSASSHA2660914 | FURNACE FURNACE FURNACE | YIELD ENGINEERING SYSTEMS, INC. | SCIENTECH ENGINEERING CORPORATION | 17 juil. 2026 | China | 17,090 kg | 24 PKG |
| 2 | OLBVSRE40752LGB | WAFER CLEAN SYSTEM WAFER CLEAN SYSTEM WAFER CLEAN SYSTEM | YIELD ENGINEERING SYSTEMS, INC | ZEUS ENTERPRISE LLC | 14 déc. 2025 | South Korea | 21,229 kg | 15 PKG |
| 3 | CMDUJP10349051 | ------------ SEKU5821893 DESCRIPTION----------------------GENERIC DESCRIPTION------------- ------------ CAXU5726751 DESCRIPTION---------OVERSIZE - HEIGHT: 129.1 CM - LEFT: 0.5 CM - RIGHT: 0.5 CM -------------GENERIC DESCRIPTION-------------GLASS INTERPOSER ETCHING EQUIPMENT (WET STATION) S/NO. : ESR004B, COUNTRY OF ORIGIN : JAPAN HS CODE:8486.90 EMAIL: OI DIMSFO DIMERCO .COM FREIGHT COLLECT AS ARRANGED WAYBILL THIS MASTER BILL COVERS NON AUTOMATED NVOCC HBILL: JP10349051 ------------ ECMU6634680 DESCRIPTION---------OVERSIZE - HEIGHT: 129.1 CM - LEFT: 0.5 CM - RIGHT: 0.5 CM -------------GENERIC DESCRIPTION-------------GLASS INTERPOSER ETCHING EQUIPMENT (WET STATION) S/NO. : ESR004B, COUNTRY OF ORIGIN : JAPAN HS CODE:8486.90 EMAIL: OI DIMSFO DIMERCO .COM FREIGHT COLLECT AS ARRANGED WAYBILL ------------ TCLU7713439 DESCRIPTION---------OVERSIZE - HEIGHT: 83.2 CM -------------GENERIC DESCRIPTION------------- ------------ ECMU6645350 DESCRIPTION---------OVERSIZE - HEIGHT: 129.1 CM - LEFT: 0.5 CM - RIGHT: 0.5 CM -------------GENERIC DESCRIPTION-------------GLASS INTERPOSER ETCHING EQUIPMENT (WET STATION) S/NO. : ESR004B, COUNTRY OF ORIGIN : JAPAN HS CODE:8486.90 EMAIL: OI DIMSFO DIMERCO .COM FREIGHT COLLECT AS ARRANGED WAYBILL ------------ ECMU6635109 DESCRIPTION---------OVERSIZE - HEIGHT: 129.1 CM - LEFT: 0.5 CM - RIGHT: 0.5 CM -------------GENERIC DESCRIPTION-------------GLASS INTERPOSER ETCHING EQUIPMENT (WET STATION) S/NO. : ESR004B, COUNTRY OF ORIGIN : JAPAN HS CODE:8486.90 EMAIL: OI DIMSFO DIMERCO .COM FREIGHT COLLECT AS ARRANGED WAYBILL | YIELD ENGINEERING SYSTEMS, INC. | JET CO.,LTD | 7 févr. 2025 | South Korea | 28,810 kg | 20 CAS |
| 4 | UASI2913632381 | SEMICONDUCTOR WAFER STORING UNIT HS CODE 848640 | YIELD ENGINEERING SYSTEMS INC | TDK CORPORATION | 29 janv. 2025 | Japan | 416 kg | 4 CAS |
| 5 | CMDUJP10348883 | ------------ TCLU6075685 DESCRIPTION---------OVERSIZE - HEIGHT: 129.1 CM - LEFT: 0.5 CM - RIGHT: 0.5 CM -------------GENERIC DESCRIPTION-------------GLASS INTERPOSER ETCHING EQUIPMENT (WET STATION) S/NO. : ESR004B, COUNTRY OF ORIGIN : JAPAN HS CODE:8486.90 EMAIL: OI DIMSFO DIMERCO .COM FREIGHT COLLECT AS ARRANGED WAYBILL ------------ TCLU6051718 DESCRIPTION---------OVERSIZE - HEIGHT: 129.1 CM - LEFT: 0.5 CM - RIGHT: 0.5 CM -------------GENERIC DESCRIPTION-------------GLASS INTERPOSER ETCHING EQUIPMENT (WET STATION) S/NO. : ESR004B, COUNTRY OF ORIGIN : JAPAN HS CODE:8486.90 EMAIL: OI DIMSFO DIMERCO .COM FREIGHT COLLECT AS ARRANGED WAYBILL ------------ AMFU5001148 DESCRIPTION---------OVERSIZE - HEIGHT: 87.2 CM -------------GENERIC DESCRIPTION------------- | YIELD ENGINEERING SYSTEMS, INC. | JET CO.,LTD | 16 janv. 2025 | South Korea | 13,600 kg | 10 CAS |
| 6 | UASI2913434216 | SEMICONDUCTOR DEVICE STORING UNIT HS CODE 848620 | YIELD ENGINEERING SYSTEMS INC | TDK CORPORATION | 2 janv. 2025 | Japan | 885 kg | 3 CAS |
| 7 | UASI291343392T | SEMICONDUCTOR DEVICE STORING UNIT HS CODE 848620 | YIELD ENGINEERING SYSTEMS INC | TDK CORPORATION | 2 janv. 2025 | Japan | 894 kg | 3 CAS |
| 8 | UASI2913432929 | SEMICONDUCTOR DEVICE STORING UNIT HS CODE 848620 | YIELD ENGINEERING SYSTEMS INC | TDK CORPORATION | 2 janv. 2025 | Japan | 890 kg | 3 CAS |
| 9 | BNXCCHI24090036 | SEMICONDUCTOR PARTS | YIELD ENGINEERING SYSTEMS, INC. | BENHMARK ELECTRONICS (M) SDN BHD | 22 nov. 2024 | China | 690 kg | 2 CRT |
| 10 | LCGMLGOAK243044 | EFEM,4LP,200/300MM X4 RFID OPTION,4LP EFEM LOADPORT KIT,N2 OPTION V2,4LP EFEM ASSY,END EFFECTOR,FORK, 3MM WARP OPTION,MAPPING WRIST,REGULAR EE ALIGNER,RA420,200/300,+/-3MM WARP | YIELD ENGINEERING SYSTEMS,INC | RORZE ROBOTECH CO., LTD. | 15 nov. 2024 | China Taiwan | 1,880 kg | 3 CAS |